Shenzhen Hongcheng Electronic Technology Co., Ltd

Expert in Plasma Surface Treatment and Intelligent Manufacturing Solutions Since 2007
Established in 2007, Shenzhen Hongcheng Electronic Technology Co., Ltd. has dedicated 16 years to advancing plasma surface treatment technologies. As a national high-tech enterprise, we deliver integrated solutions encompassing precision equipment R&D, smart production line integration, and process optimization across nine major industries, including electronics manufacturing, automotive engineering, and medical devices. Our 50-member team, including a 20-member core R&D team, drives innovation in equipment, processes, and tailored services.

Dual-Core Product Portfolio

• Plasma surface treatment systems: fully self-developed atmospheric/vacuum dual-mode equipment for nanoscale surface modification, supporting 12 critical processes (cleaning, activation, etching) across 32 substrates (ceramics, metals, composites).
• Customized automation equipment: modular intelligent platforms with rapid integration of vision positioning, robotic arms, and inline inspection systems, achieving 99.2% operational uptime for 24/7 continuous production.

Custom Development Workflow
We implement VOC (Voice of Customer) feedback mechanisms with dedicated project managers, process engineers, and electrical engineers to ensure 48-hour demand analysis and finalization, 15-day prototype delivery for non-standard equipment, and 30-day full production line integration and debugging.

Quality Assurance Protocol

• TUV Rheinland-certified core components
• 16-stage manufacturing inspection process
• 72-hour endurance testing

Global Service Network
We have a "2-hour online diagnosis + 8-hour on-site support" system, backed by spare parts warehouses covering 15 major industrial clusters nationwide. The integrated inline plasma treatment and smart coating system can deliver a 92% reduction in volatile organic compound (VOC) emissions, and the adhesion strength can be upgraded to the 5B level according to the ASTM D3359 standard. Moreover, our daily output can reach 1,200 modules.

Join Us Now
Focusing on semiconductor packaging and flexible electronics, we are collaborating with the Chinese Academy of Sciences (Shenzhen) pioneer of roll-to-roll (R2R) continuous processing systems, microwave plasma-enhanced technology, and industry 4.0 remote operation platforms. You are welcome to join us now.